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multi layer pcb fabrication process 10 layer pcb with blue glue multilayer pcb boards

multi layer pcb fabrication process 10 layer pcb with blue glue multilayer pcb boards

multi layer pcb fabrication process 10 layer pcb with blue glue multilayer pcb boards

Brand Name:	hengsheng
Model Number:	HSG5046
MOQ:	1 pz
Price:	USD 0.1-5/pcs
Delivery Time:	7-10 giorni di lavorazione
Payment Terms:	L/C, T/T, Western Union

Detail Information

Descrizione del prodotto

Detail Information

Luogo di origine:

Cina

Certificazione:

UL,ISO9001,TS16949

Spessore del pannello:

0.2-4.0mm

Spessore del rame:

1/2oz-5oz

Controllo dell'impedenza:

±10%

Conteggio degli strati:

2-20

Materiale:

FR4/Alta TG/Alluminio/Rogers/Teflon

Max. Dimensione del consiglio:

580*1200mm

Minuto di spessore del bordo:

0,2 mm

minimo Dimensione del foro:

0,2 mm

Minuti linea larghezza/spazio:

3/3MIL

Min. Silkscreen Laming Larghezza:

0,15 mm

Min. Diga di maschera di saldatura:

0,1 mm

Finitura superficiale:

OSP/HASL/ENIG/Immersione Oro/Argento

Imballaggi particolari:

25 kg/cartone, imballaggio sottovuoto

Capacità di alimentazione:

100000 pezzi al mese

Descrizione del prodotto

Process Capability And Checking Parameters(Hard Board) NO ITEM Technical Capabilities 1 Layers 1-38L 2 Max.Board Size 1200*610mm 48"*24" 3 Finished Board Thickness 0.2mm--10.0mm 0.008"--0.4" 4 Finished Copper Thickness 17um-420um 0.5OZ--12OZ 5 Min.Trace Width/Space 0.075mm/0.065mm 0.003"/0.0026" 6 Min.Hole Size 0.15mm 0.006" 7 Hole Dim. Tolerance(PTH) ±0.05mm ±0.002" 8 Hole Dim.Tolerance(NPTH) ±0.05mm ±0.002" 9 Drill Location Tolerance ±0.05mm ±0.002&

Tags:

multilayer pcb

pcb multilayer

print circuit board

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