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Multilayer pcb fabrications 12 layer circuit board FR4 material TG170 gold platting computer graphics pcb

Brand Name:	hengsheng
Model Number:	HS6025
MOQ:	1 pz
Price:	USD 0.1-5/pcs
Delivery Time:	7-10 giorni di lavorazione
Payment Terms:	T/T, Western Union

Detail Information

Descrizione del prodotto

Detail Information

Luogo di origine:

Cina

Certificazione:

UL, ROHS,SGS,ISO9001

Materail:

FR-4

Spessore:

1,6 mm

Rame:

50 mm

Superficie:

Placcatura in oro

Saldare:

blu, nero, viola

Min Hole:

0,25 mm

Imballaggi particolari:

25 kg/cartone, imballaggio sottovuoto

Capacità di alimentazione:

100000 pezzi al mese

Descrizione del prodotto

Process Capability And Checking Parameters(Rigid PCB) NO ITEM Technical Capabilities 1 Layers 1-38L 2 Max.Board Size 1200*610mm 48"*24" 3 Finished Board Thickness 0.2mm--10.0mm 0.008"--0.4" 4 Finished Copper Thickness 17um-420um 0.5OZ--12OZ 5 Min.Trace Width/Space 0.075mm/0.065mm 0.003"/0.0026" 6 Min.Hole Size 0.15mm 0.006" 7 Hole Dim. Tolerance(PTH) ±0.05mm ±0.002" 8 Hole Dim.Tolerance(NPTH) ±0.05mm ±0.002" 9 Drill Location Tolerance ±0.05mm ±0.002&q

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products details

Multilayer pcb fabrications 12 layer circuit board FR4 material TG170 gold platting computer graphics pcb

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